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How to Approach Security for Multi-Die Designs
Featured Speaker:
- Dana Neustadter, Senior Director of Product Management, 草榴社区
Why You Should Attend:
Security is a big concern for electronic systems, driven by technological advancements and increasing regulatory demands. Multi-die designs introduce additional complexity, with vulnerabilities arising from varied chiplet functions and a fragmented supply chain. Standards organizations play a vital role in addressing these challenges by defining security levels, procedures, and certification tests, ensuring chiplet conformance, and emphasizing the collective responsibility of securing advanced semiconductor systems. Security requirements should encompass chiplets, chiplet interconnects, and the overall system.
- Learn about the latest security issues and solutions for electronic systems.
- Understand vulnerabilities and complexities in multi-die designs.
- Gain insights into industry standards and certification processes.
- Explore robust identification, authentication, and secure communication methods.
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Featured Speaker
Dana Neustadter
Senior Director of Product Management, 草榴社区
Dana is Senior Director of Product Management for 草榴社区' security solutions, where she works on problems ranging from automotive applications through interface IP and on up to quantum computing cyberattacks. She has 25+ years of experience in the security, IP, semiconductor, and EDA industries with an emphasis on product strategy, roadmaps, and marketing for security IP. Dana earned an MSEE from the Technical University Cluj-Napoca (Romania).